Manz AG Expands RDL Process Equipment Portfolio, Unveils Innovations at SEMICON SEA 2024
Published on: Monday, May 20, 2024
Manz RDL solutions take a deep dive into panel-level packaging and TGV process
Kuala Lumpur: Manz AG, a global leader in high-tech equipment manufacturing, is proud to announce its participation in SEMICON Southeast Asia 2024, taking place at MITEC from May 28-30.
At this prestigious event, Manz AG will showcase its newest advancements in RDL (Redistribution Layer) process equipment, aimed at revolutionizing panel-level packaging production and meeting the evolving demands of the semiconductor industry.
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In today's fast-paced technological landscape, semiconductor manufacturers face increasing pressure to deliver smaller, more powerful integrated circuits.
Manz AG recognizes the critical role that advanced packaging technology plays in enabling this transformation, and is committed to providing cutting-edge solutions to support its customers' success.
Manz digital printing system
With a focus on innovation and collaboration, Manz AG offers a comprehensive range of production solutions and technologies designed to address the complex challenges of conductor layer formation in panel-level packaging.
From wet chemistry cleaning to through-via fabrication, the company's portfolio covers every aspect of the manufacturing process, ensuring efficiency, reliability, and cost-effectiveness.
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One of the highlights of Manz AG's showcase at SEMICON Southeast Asia 2024 is its newly developed digital printing systems.
These state-of-the-art systems streamline the RDL creation process by enabling precise material placement and customization, resulting in significant improvements in production flexibility and efficiency.
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By reducing the number of process steps required, these digital printing solutions help semiconductor manufacturers optimize their workflows and achieve faster time-to-market.
Collaboration is at the heart of Manz AG's approach to business transformation.
Manz electroplating systems provide single- or double-sided process capability, available with customized design to ensure excellent manufacturing efficiency.
By partnering with supply chain stakeholders and leveraging its extensive expertise in RDL process equipment, the company aims to accelerate the adoption of advanced packaging technologies and empower its customers to stay ahead of the competition.
Mr. Robert Lin, General Manager of Manz AG Asia, emphasizes the company's commitment to customer success: "At Manz AG, we are dedicated to providing our customers with the tools and support they need to thrive in an ever-changing industry.
Our latest innovations in RDL process equipment are a testament to this commitment, and we are excited to share them with the semiconductor community at SEMICON Southeast Asia 2024."
As the semiconductor industry continues to evolve, Manz AG remains at the forefront, driving innovation and shaping the future of advanced packaging technology.
Visit Manz AG's booth at SEMICON Southeast Asia 2024 to learn more about its latest RDL process equipment innovations and solutions.
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